In the evolution of the PCB (Printed Circuit Board) industry towards higher density, multi-layering, and thinner designs, thermocompression molding stands as a pivotal process determining the interlayer bonding strength, flatness, and electrical performance of PCBs. Serving as an essential functional consumable in the thermocompression process, PCB thermocompression layer paper (also known as PCB lamination separator paper or lamination pad paper) plays multiple crucial roles, including cushioning and pressure relief, uniform heat transfer, glue resistance and anti-adhesion, as well as breathability and moisture dissipation. These functions directly impact the yield rate and service life of PCB products. According to industry data, issues such as interlayer delamination, glue overflow, and board surface depressions, which are caused by substandard performance of thermocompression layer paper, account for over 38% of the defective rate in multi-layer PCB production. As downstream sectors like 5G communication, automotive electronics, and semiconductor packaging demand higher precision PCBs, coupled with tightening environmental policies, PCB thermocompression layer paper is evolving from a basic auxiliary consumable to a high-performance, customized, and eco-friendly product. It is becoming a core supporting component in the high-end manufacturing of PCBs.
1. Core definition and mechanism of action: Analyzing the core value of PCB thermal compression layer paper
PCB hot-press layer pad paper is a functional paper specifically designed for the hot-press molding process of multi-layer PCBs. Through special raw material ratios and process treatments, it possesses core properties such as high temperature resistance, high pressure resistance, good cushioning, glue resistance and anti-adhesion, as well as breathability and moisture permeability. It is primarily used during the lamination and pressing of multi-layer PCBs, placed between the press plate and the PCB substrate or between PCB layers, to create a stable hot-press environment, ensuring the smooth progress of the pressing process and the consistency of product quality.
Compared to ordinary industrial paper pads, the core difference of PCB hot-pressing layer paper pads lies in their adaptability to the specificity of PCB hot-pressing processes - they must maintain stable performance, without decomposing, adhering, or contaminating PCB substrates, under high temperature conditions ranging from 120 to 220℃ and high pressure conditions ranging from 1.0 to 4.0MPa. At the same time, they achieve multiple functional synergies. Their mechanism of action is mainly reflected in the following four aspects:
Firstly, it serves to buffer and reduce pressure, ensuring uniform force distribution. During the PCB hot pressing process, there are issues of micro-gaps and uneven force distribution between the press plate and the PCB substrate. The hot pressing layer pad paper, with its inherent fiber structure elasticity, can effectively buffer high-pressure impacts, distributing the pressure uniformly to every area of the PCB laminate, thus avoiding local pressure overload that could lead to board surface depressions and interlayer dislocations. Additionally, it reduces wear on the press plate, extending the service life of the equipment. Especially in the fast pressing process of flexible PCBs, the buffering performance of high-quality pad paper can significantly enhance the flatness of the press fit, reducing the risk of bending deformation in flexible substrates.
Secondly, uniform heat transfer and temperature stability. The core requirement of hot pressing is that the temperature of each area of the PCB laminate should be uniform, ensuring that the resin is fully melted, flows, and cures. The PCB hot pressing layer pad paper adopts fiber materials with excellent thermal conductivity and a composite structure, which can quickly conduct heat, reduce temperature gradients, and control the temperature difference between the surface and the interior of the PCB laminate within ±5℃, avoiding problems such as resin carbonization and interlayer bubbles caused by locally high temperatures, or insufficient resin curing and inadequate interlayer bonding caused by locally low temperatures.
Thirdly, it is about glue resistance, anti-adhesion, and cleanliness protection. During the lamination of multi-layer PCBs, the resin between the substrates will melt and overflow under high temperature and pressure. If it directly adheres to the press plate or PCB surface, it will lead to product scrap and difficulty in equipment cleaning. PCB hot-press layer pads, with special surface coatings (such as TPX silicone-free release layer) or fiber modification treatment, exhibit excellent anti-adhesion properties. They can adsorb excess resin, prevent resin adhesion, and also prevent the fibers of the pad itself from falling off and contaminating the PCB surface, ensuring the conductivity and cleanliness of the PCB circuit. Among them, the silicone-free anti-adhesion design can avoid the impact of silicone contamination on subsequent soldering and packaging processes of PCBs, and has become one of the core features of high-end PCB pads.
Fourth, breathability, moisture wicking, and bubble elimination. Residual air in PCB laminations and moisture in resin can expand and form bubbles during hot pressing, leading to defects such as interlayer delamination and voids. PCB hot pressing layer paper, with its special porous fiber structure or perforated breathable design, can quickly expel the water vapor and air generated during hot pressing, providing a channel for the flow of molten resin, ensuring tight interlayer bonding, effectively reducing the rate of defective interlayer bubbles in PCBs, and reducing the traditional paper-induced bubble defect rate from 12% to less than 1.5%.
II. Classification and Core Process: Product System Adapted to Different PCB Scenarios
With the diversification of PCB product types (rigid PCB, flexible PCB, rigid-flex PCB, HDI board, etc.), there are significant differences in hot pressing process parameters (temperature, pressure, time). PCB hot pressing layer spacers have formed a targeted product system, which can be divided into three major mainstream categories based on substrate type, process characteristics, and application scenarios. Each type of product has its own focus in terms of performance and application, while the core production process is also upgrading towards refinement and environmental friendliness.
(1) Classification by substrate type
1. Wood pulp-based hot press layer paper: Made primarily from high-purity softwood pulp and hardwood pulp, with a small amount of cotton fiber or peanut shell fiber, it is processed through papermaking, molding, and modification. It is currently the most widely used type in the global PCB hot press layer paper market, accounting for over 65% of the market share. Its advantages lie in controllable cost, good cushioning, excellent breathability, and high temperature resistance up to 180℃. It is suitable for the hot pressing process of medium and low-end rigid PCBs and ordinary multilayer boards, meeting the requirements of conventional hot pressing processes (120~180℃, 1.0~2.5MPa). Some products can be enhanced by adding composite wet strength agents and flame retardants to improve mechanical strength and flame retardant properties, making them suitable for PCB production scenarios with flame retardant requirements.
2. Composite base hot pressing layer pad paper: It is made of two or more composite substrates, with two core structures: "paper base + functional coating" and "paper base + fiber reinforcement layer". It is the mainstream choice for mid-to-high-end PCBs. Among them, the "paper base + TPX silicone-free release layer" composite pad paper is the most common. The bottom layer is a wood pulp paper base that provides cushioning and breathability, while the surface layer is a TPX (poly-4-methylpentene) silicone-free release layer, which has excellent anti-adhesion and high temperature resistance properties, with a high temperature resistance of up to 220°C. It is suitable for the hot pressing process of flexible PCBs, HDI boards, and high-frequency high-speed PCBs, effectively avoiding silicon contamination and resin adhesion. Some high-end products also add a PBT (polybutylene terephthalate) back-coated breathable layer, which further enhances the breathability and moisture dissipation effect through a puncture pressure hole design, adapting to the fast pressing process requirements of flexible PCBs.
3. Specialty Base Hot Press Liner Paper: Designed specifically for special PCB products, it primarily includes sulfur-free hot press liner paper, flame-retardant hot press liner paper, and high-temperature resistant hot press liner paper. The sulfur-free hot press liner paper adopts a "total chlorine-free bleaching + low-temperature sulfur removal" process, controlling the sulfur content to below 50ppm, making it suitable for PCB silvering processes and the hot pressing steps of PCBs used in semiconductor packaging, effectively preventing PCB conductivity failure caused by sulfur corrosion. The flame-retardant hot press liner paper incorporates halogen-free composite flame retardants (such as cardanol-modified phenolic resin and ammonium polyphosphate), offering excellent flame retardant properties, and is suitable for PCB products with stringent flame retardant requirements in automotive electronics, aerospace, and other industries. The high-temperature resistant hot press liner paper utilizes high-temperature resistant materials such as aramid fibers and carbon fibers, with a high temperature resistance of over 280°C, making it suitable for high-end semiconductor packaging PCBs and high-temperature hot pressing steps of thick copper PCBs.
(II) Classification by application scenarios
1. Rigid PCB hot-press layer pad paper: Primarily used for hot-press lamination of rigid multilayer PCBs and ordinary single/double-sided boards, it emphasizes cushioning, breathability, and adhesive resistance. With a high temperature resistance range of 120~180℃ and a typical thickness of 0.1~0.3mm, it can be customized according to the number of PCB layers and thickness, making it suitable for mass production scenarios and offering outstanding cost-effectiveness.
2. Flexible PCB hot pressing layer pad paper: Designed for the fast pressing and laminating processes of flexible PCB (FPC), it possesses excellent flexibility, anti-adhesion, and dimensional stability, with a shrinkage ratio of ≤0.3%, effectively preventing issues such as bending, wrinkling, and adhesion during the hot pressing process of flexible substrates. Its typical structure consists of "TPX silicone-free release layer + cushion layer + base paper layer + PBT back-coated breathable layer". The cushion layer can be made from a blend of TPX and PP, balancing flexibility and cushioning performance to meet the precise pressing requirements of flexible PCBs.
3. High-end PCB thermal compression layer pad paper: suitable for high-end products such as HDI boards, high-frequency and high-speed PCBs, and PCBs for semiconductor packaging, featuring high temperature resistance (200~280℃), high pressure resistance (3.0~4.0MPa), low contamination, high dimensional stability, with a surface roughness of ≤0.05μm and no fiber shedding. It can meet the stringent requirements of high-end PCBs for cleanliness and interlayer bonding strength, and is a core supporting consumable for high-end PCB manufacturing.
(III) Core production process
The performance of PCB hot-pressed layer paper primarily hinges on the precision of raw material ratios and production processes. Currently, mainstream processes are primarily categorized into three types. Incorporating patent technology and industry trends, they are evolving towards environmental friendliness and standardization:
1. Paper-making process: This process is primarily used for the production of wood pulp-based hot-pressed layered paper. After pulping, screening, and purification of raw materials such as softwood pulp and hardwood pulp, auxiliary materials such as wet strength agents and dispersants are added. The paper is then made, pressed, dried, and shaped by a paper machine. After surface polishing and modification treatment, the flatness and high temperature resistance of the paper are improved. The key to this process is to control the fiber ratio and pulpability, ensuring a balance between the cushioning and breathability of the paper. At the same time, the moisture content of the paper is reduced through drying treatment (≤8%) to avoid generating additional water vapor during the hot pressing process.
2. Composite Coating Process: Primarily used in the production of mid-to-high-end composite base hot-pressed layer paper, it is divided into two methods: "Lamination Coating" and "Coating Compound". Among them, the lamination coating process is the most widely used. Its process mainly includes: first, drying and corona treatment of the base paper layer (with a reel tension of 3~5 bar and a corona tension of 3~5 bar) to enhance the surface adhesion of the base paper; second, using a double-layer co-extrusion method, adding TPX silicone-free release layer and buffer layer raw materials separately to a twin-screw lamination machine, heating and melting them, and then laminating them on one side of the base paper to form a semi-finished product; third, adding PBT back-coated breathable layer raw materials to a single-screw lamination machine, laminating them on the other side of the base paper to form a complete composite structure; fourth, punching and pressing holes in the PBT back-coated breathable layer through a round knife die, drying, and winding (with a winding tension of 3~5 bar) to form the finished product. The coating compound process involves uniformly coating a release coating (such as silicone or TPX resin) on the surface of the paper base, which, after drying and curing, forms a release layer. This process is simple and cost-effective, but its release performance and high temperature resistance are slightly inferior to the lamination coating process.
3. Special modification process: For the production of special-based hot-pressed laminating paper, it mainly includes sulfur-free treatment, flame retardant modification, and high temperature resistance modification. The sulfur-free treatment adopts a low-temperature desulfurization process to remove sulfur elements from raw materials, ensuring that the sulfur content is ≤50ppm; flame retardant modification involves adding halogen-free composite flame retardants to the pulp to form a stable chemical cross-linking network, enhancing the flame retardant properties of the paper; high temperature resistance modification involves adding high temperature resistant materials such as aramid fibers and carbon fibers, or carbonizing the fibers, to improve the high temperature and high pressure resistance of the paper, meeting the needs of high-end PCB hot-pressing processes.
III. Core performance indicators and testing standards: the key to ensuring PCB lamination quality
The performance of PCB hot press layer paper directly determines the quality of PCB lamination. The industry has established a clear performance indicator system and testing standards to ensure that products are compatible with different PCB hot press processes, while also ensuring the uniformity and compliance of product quality. The core performance indicators are mainly divided into three categories: basic performance, process compatibility performance, and environmental performance. The testing standards cover both domestic and international specifications.
(1) Core performance indicators
1. High temperature resistance: It measures the performance stability of the paper pad in a hot pressing environment. The core indicators are long-term use temperature and short-term tolerance temperature. The long-term use temperature of ordinary paper pads is 120~180℃, and the short-term tolerance temperature is 200℃; the long-term use temperature of mid-to-high-end paper pads is 180~220℃, and the short-term tolerance temperature is 250℃; the long-term use temperature of high-end specialty paper pads is ≥220℃, and the short-term tolerance temperature is ≥280℃. It is required that at the corresponding temperature, the paper pad should have no shrinkage, no decomposition, no odor, and its performance should remain stable, with a shrinkage rate of ≤0.3% (test method: take a 200mm×200mm sample, place it in an oven at 180℃ for 2 minutes, and calculate the shrinkage ratio).
2. High-pressure resistance: Ensure that the paper pad remains intact and does not undergo compression deformation under high-pressure conditions during hot pressing. The core indicators are bursting strength and compressive strength. For ordinary paper pads, the bursting strength should be ≥1200kPa and the compressive strength should be ≥3.0MPa; for mid-to-high-end paper pads, the bursting strength should be ≥1800kPa and the compressive strength should be ≥4.0MPa. Under a high pressure ranging from 1.0 to 4.0MPa, the compression deformation rate should be ≤5%, and the paper pad should quickly recover its original shape after decompression, ensuring uniform pressure transmission.
3. Anti-adhesion and Resin Retention Performance: The core indicators are peel strength and resin adsorption capacity. The peel strength is ≤5g/30mm (average value obtained from 10 parallel tests), allowing for easy separation from PCB substrates and press plates without resin residue. The resin adsorption capacity is ≥15g/m², effectively adsorbing excess resin spilled during the hot pressing process to prevent resin adhesion and board surface contamination. Silicone-free release paper must also meet the requirement of no silicone residue, to avoid affecting subsequent PCB soldering processes.
4. Breathability and Moisture Wicking: The core indicator is breathability. The breathability of ordinary paper pads is ≥100mL/(cm²·min), while that of mid-to-high-end paper pads is ≥150mL/(cm²·min). This allows for rapid removal of moisture and air during the hot pressing process, reducing the rate of defective bubbles between PCB layers. Products with a PBT back-coated breathable layer exhibit superior breathability and can meet the efficient moisture wicking requirements of fast pressing processes.
5. Dimensional stability: Ensure that the pad paper does not show significant shrinkage or deformation under high temperature and high pressure. The core indicators are thermal shrinkage rate and dimensional deviation. The thermal shrinkage rate should be ≤0.3% (180℃, 2min), and the dimensional deviation should be ≤±0.1mm/m. Avoid issues such as PCB interlayer misalignment and uneven board surface caused by pad paper deformation, especially for the lamination requirements of precision PCBs.
6. Environmental Protection and Cleanliness: Compliant with environmental standards such as RoHS 2.0 and REACH, it contains no heavy metals or harmful volatile substances. In terms of cleanliness, the surface is free of impurities and fiber shedding, with a dust particle count per square meter of ≤5 particles (≥0.3μm). The sulfur content of sulfur-free paper pads is ≤50ppm, ensuring no contamination of PCB substrates and the production environment.
(II) Core testing standards
1. Domestic standards: These primarily include GB/T 450-2002 "Paper and Board - Sampling", GB/T 454-2002 "Paper and Board - Determination of Bursting Strength", GB/T 10342-2002 "Packaging and Marking of Paper", as well as the specialized standard for the electronics industry, SJ/T 11495-2016 "General Specification for Anti-static Packaging Materials Used in the Electronics Industry" (applicable to hot-pressed laminated paper with anti-static function). These standards specify the performance requirements, testing methods, and qualification criteria for PCB hot-pressed laminated paper, serving as the core basis for production and testing for domestic enterprises.
2. International standards: These primarily include IPC-4101B "Specification for Base Materials for Rigid and Multilayer Printed Boards", ASTM D3451-2019 "Test Method for High-Temperature Resistance of Paper and Paperboard", and ISO 2874 "Determination of Permeability of Paper and Paperboard". Among them, IPC-4101B specifies core requirements for high-end PCB laminating paper, such as cleanliness, high-temperature resistance, and anti-adhesion, and serves as the core compliance basis for export products. Furthermore, EU RoHS 2.0, US UL certification, and other standards are also prerequisites for high-end PCB laminating paper to enter the international market.
IV. Application Fields: Penetrating the entire PCB industry chain, with continuously upgrading demands
PCB thermal lamination paper, as a core consumable in PCB production, has deeply penetrated into the entire PCB industry chain. From ordinary rigid PCBs to high-end flexible PCBs, HDI boards, and PCBs for semiconductor packaging, it is indispensable for their support. With the rapid development of the downstream electronics industry, PCB products are upgrading towards high density, multi-layer, and lightweight, driving the continuous growth of demand for PCB thermal lamination paper and expanding its application fields. Among them, the high-end PCB field has become the core driving force for demand growth.
(1) Rigid PCB field
As the primary application field, the demand in the rigid PCB sector accounts for over 60% of the global PCB thermal compression layer paper market. It is primarily used for the production of ordinary multilayer PCBs, single/double-sided boards in consumer electronics, computers, communication equipment, and other fields. Such scenarios primarily require basic performance from the paper, focusing on meeting the needs of cushioning, breathability, and glue resistance, with cost-effectiveness being a priority. Wood pulp-based thermal compression layer paper is mainly used, suitable for conventional thermal compression processes at temperatures ranging from 120 to 180°C. As consumer electronics continue to evolve towards thinner and lighter designs, the number of layers in rigid PCBs is increasing (from 4 or 8 layers to 16 or 32 layers), leading to higher requirements for the dimensional stability and pressure uniformity of the paper. This is driving the gradual increase in the penetration rate of mid-to-high-end composite-based paper.
(II) Flexible PCB (FPC) field
The flexible PCB field represents the fastest-growing application scenario for PCB hot-press layer paper, with an expected compound growth rate of 15% from 2025 to 2035. With the rapid development of 5G mobile phones, wearable devices, automotive electronics, and other fields, the demand for flexible PCBs continues to surge. The fast-press and laminating processes of flexible PCBs demand extremely high flexibility, anti-adhesion, and dimensional stability from the paper, necessitating the use of composite-based hot-press layer paper (such as TPX silicon-free composite paper) to avoid issues such as bending, adhesion, and silicon contamination of the flexible substrate. For instance, after a flexible PCB manufacturer adopted high-end TPX silicon-free composite paper, the hot-press failure rate decreased from 8.3% to 0.9%, production efficiency increased by over 20%, and production costs were significantly reduced.
(III) High-end PCB field
The high-end PCB field (HDI boards, high-frequency high-speed PCBs, and PCBs for semiconductor packaging) has the most stringent performance requirements for thermal compression layer pads, making them a core application scenario for mid-to-high-end specialty pads. HDI boards and high-frequency high-speed PCBs are used in 5G base stations, servers, high-end routers, and other equipment, requiring pads with high temperature resistance, low contamination, and high dimensional stability to avoid affecting the signal transmission performance of the PCB. PCBs for semiconductor packaging (such as IC carrier boards) require pads to be sulfur-free, silicon-free, and highly clean, eliminating sulfur corrosion and silicon contamination to ensure the packaging reliability of semiconductor chips. They mainly use sulfur-free, high-temperature resistant specialty base thermal compression layer pads.
(IV) Other fields
In addition to PCB production, PCB hot-pressing layer paper can also be used in the hot-pressing and forming processes of copper-clad laminates and flexible copper-clad laminates, as well as in high-temperature packaging of electronic components and hot-press bonding of precision instruments. Its core advantages lie in its high temperature resistance, anti-sticking property, and cushioning performance, making it suitable for different high-temperature and high-pressure process requirements and an indispensable functional consumable in the field of electronic manufacturing.
5、 Industry Development Status and Future Trends: Opportunities and Challenges Coexist
At present, the global PCB hot press layer paper industry is in a rapid development stage, with a continuously expanding market size. At the same time, it faces multiple challenges such as raw material upgrades, technological innovation, and environmental compliance. In the future, it will achieve high-quality development in the direction of high performance, customization, greening, and refinement, resonating with the upgrading of the PCB industry.
（1） Industry Development Status
1. Market size continues to grow: The global PCB hot press layer pad paper market is expected to reach 860 million US dollars by 2025 and surpass 1.4 billion US dollars by 2030, with an average annual compound growth rate of 10.8%; As the world's largest PCB production country, China accounts for over 70% of the global PCB production capacity. By 2025, the domestic PCB hot press layer pad paper market will reach 4.8 billion yuan, and is expected to exceed 8.5 billion yuan by 2030. The main driving force comes from the expansion of downstream PCB industries and the increase in penetration rate of high-end PCB products.
2. Continuous upgrading of product structure: Low end wood pulp based pad paper still holds a certain market share, but the growth rate of mid to high end composite based pad paper and special pad paper is faster. Silicon free, sulfur free, high temperature resistant, and high cleanliness products have become market hotspots. For example, the market penetration rate of TPX silicon free composite pad paper and sulfur free pad paper has been increasing year by year. The application of new materials such as aramid fiber and graphene has further improved the high temperature resistance and mechanical properties of the products. The cycle from laboratory to commercialization of new materials has been compressed from 20 months to 12 months.
3. Collaborative acceleration of the industrial chain: The collaborative innovation between upstream raw material suppliers (wood pulp, TPX resin, flame retardant manufacturers) and midstream manufacturing enterprises, as well as downstream PCB manufacturers, is becoming increasingly close. Leading enterprises are establishing joint laboratories to jointly develop new hot press layer pads that are suitable for high-end PCB processes. At the same time, midstream enterprises are transitioning from standardized production to customized services, customizing exclusive paper products based on downstream customers' hot pressing process parameters (temperature, pressure, PCB type) to enhance the value of the industry chain.
4. Challenges still exist: firstly, high-end raw materials rely on imports, and core materials such as TPX resin and high-end aramid fiber still heavily rely on overseas suppliers, with a localization rate of less than 30%, resulting in high production costs for high-end pad paper; Secondly, there is a lack of technological innovation capability, with some enterprises still stuck in traditional copying and coating processes. The application capabilities of high-end film coating composite processes and special modification processes are weak, and there is a gap in product performance compared to international leading enterprises; Thirdly, the pressure on environmental protection has increased, and traditional products containing silicon coatings and halogen flame retardants are facing elimination. The research and promotion costs of green environmental protection processes are relatively high; Fourthly, industry standards need to be improved, and specific standards for segmented scenarios such as flexible PCB fast pressing and semiconductor packaging PCBs are still unclear, resulting in uneven product quality.
（2） Future Development Trends
1. Greening has become a core trend: Under the "dual carbon" policy and environmental compliance requirements, silicon free, sulfur free, halogen-free, and recyclable PCB hot press layer pads will become the mainstream in the market. In the future, the application of environmentally friendly raw materials such as bio based resins and halogen-free flame retardants will be more widespread, and production processes will be upgraded towards solvent-free and low emission directions. At the same time, the recycling and reuse of cushioning paper will be promoted to reduce industry carbon emissions. For example, biodegradable wood pulp based pad paper has gradually been applied in ordinary PCB production, which can naturally degrade after use, balancing environmental protection and performance.
2. Integration of high performance and multifunctionality: The refined demand for downstream high-end PCBs will drive the upgrading of hot press layer paper pads to "one pad multi energy". In addition to the core functions of buffering, heat transfer, adhesive resistance, and breathability, it will integrate multiple functions such as anti-static, anti-corrosion, high temperature resistance, and traceability. For example, the hot pressed layer paper with integrated anti-static function can avoid the interference of static electricity on PCB circuits; The paper pad embedded with RFID chips can achieve full traceability of the production process and improve production control efficiency.
3. Customization and refinement upgrade: The demand for different PCB products and hot pressing processes varies greatly. In the future, there will be more specialized hot pressing layer pads, such as flexible PCB fast pressing pads, HDI board pads, and sulfur free pads for semiconductor packaging. Enterprises will focus on downstream scenario demands, optimize raw material ratios and process parameters, enhance product adaptability, and promote the refinement of production processes to ensure the stability and consistency of product performance.
4. Accelerated localization substitution: With the increasing demand for independent and controllable PCB industry in China, as well as the strengthening of domestic enterprises' technological innovation capabilities, the localization substitution of high-end PCB hot pressing layer paper and core raw materials will become a key trend. In the future, domestic enterprises will increase their research and development investment in high-end raw materials such as TPX resin and aramid fiber, break through core process bottlenecks such as film lamination and special modification, enhance the independent and controllable level of the industrial chain, and participate in the formulation of international standards to enhance industry discourse power.
5. Process iteration and efficiency improvement: With the upgrading of PCB production towards automation and efficiency, the production process of hot pressed layer paper pads will gradually become automated and intelligent. By introducing automated film coating, precise temperature control drying, online detection and other equipment, production efficiency and product quality will be improved, and labor costs will be reduced. At the same time, the application of new technologies such as 3D printing customized pad paper will further meet the personalized and precision needs of high-end PCBs.
